Full-Duplex Communication Technologies
Full-duplex (FD) communication is the simultaneous transmission and receiving of data on the same frequency channel in wireless networks. When compared to existing half-duplex peers, such as FDD and TDD systems, it is highly sought to improve spectrum efficiency and release expanding wireless traffic. Currently, the issues of blocking FD communication applications include:
Poor Tx-to-Rx Isolation – The self-interference signals caused by Tx-to-Rx leakage have a significant influence on the receiver’s ability to receive desirable signals.
Narrow Bandwidth – It is challenging to achieve excellent Tx-to-Rx isolation over a wide frequency range.
Compatible with Existing Half-Duplex Systems – FD communication necessitates a new architecture, design, and algorithm from the RF to the MAC layer, which is challenging to integrate into or upgrade from current FDD and TDD systems.
Our studies are focusing on FD technologies and applications including FD antenna and array, antenna-circuit interface, FD circuit architecture, digital algorithm, and so on.
System-in-Package
Millimeter-wave (30-300 GHz) and THz (0.3-3 THz) bands have been proposed as future frequency ranges for applications such as next-generation wireless communication, radar and imaging, biomedicine, and so on. One of the primary issues, however, is how to integrate multi-band, multi-channel, and multi-function systems at these frequencies. System-in-package (SiP) is one of the approaches that can link and combine multiple chips, modules, and devices into a single small block. We will concentrate our investigation on:
High Gain AoC/AiP – The main problem of system-in-package is poor radiation gain and efficiency. To address this issue, we are developing high-gain Antenna-on-Chip and Antenna-in-Package technologies based on standard CMOS and Flip-chip techniques.
High-Density Packaging – It is necessary to package multi-channels and multi-systems in a single block. We are attempting to identify the challenges in a high-density packaged system, such as EMI/EMC concerns, insertion loss of RF interconnections, intra-chip connections, and so on, and then provide solutions to these problems.
RF Integrated Circuit – The design of RF IC will place an emphasis on multi-channel RF systems, full-duplex systems, and antenna-circuit interface technologies, as well as the packaging of the RF ICs into single SiP blocks.
Stealth Technologies
The objective of stealth technology is to electromagnetically “conceal” targets, which may be separated into passive and active approaches. Passive technologies aim to absorb, attenuate, and scatter EM waves, whereas active technologies create high background noises, jamming, and interference, which can drown out detecting signals. Our efforts are centered on:
Broadband, Wide Incident-Agle and Ultrathin Absorber – Although absorber design is not a new technique, achieving an ultrathin planar absorber with a stable broad absorption band under wide incident angles for both TE and TM waves is tough. Our target is in sight.
Low-RCS Antenna Array – Reducing the radar cross section (RCS) value of the antenna and array is the targeted objective for military applications. Our techniques will provide low out-of-band, in-band, and combined out-of-band and in-band RCS for the antenna and array.
cy & Microwave Communication System Laboratory (RMCS Lab)