Zelong Qiu, the former FYP Student, presented his research work “A Broadband Microstrip-To-Microstrip Transition for Flip-Chip Interconnects” at the 2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP 2021) on November 17. IMWS-AMP is a global academic conference belonging to the MTT society which focuses on microwave studies for RF and THz applications.

The presented work is one part of Zelong’s final-year project. When he used a microstrip-to-microstrip transition to connect between an mm-Wave LTCC antenna array and the structures on RF IC, the resonance issue was observed between the on-chip ground and off-chip ground in LTCC. He found a way using a U-slot on the off-chip ground that successfully suppressed the resonance and protect the RF transition via a microstrip-to-microstrip transition in a flip-chip package.

Now, Zelong is pursuing his Master’s degree at the University of Southampton and will join the Huawei technologies company in Dongguan, Guangdong in 2022.